Search Results - "Chung H"

Atlas-guided discovery of transcription factors for T cell programming.

Authors: Chung, H. Kay Liu, Cong Battu, Anamika et al.

Source: Nature. Feb2026, p1-11. 11p.

Effect of antenatal contraceptive education and other factors on uptake of long-acting reversible contraception in postpartum women in Hong Kong.

Authors: Chung, H. K. Wan, Rebecca S. F. Li, Raymond H. W.

Source: European Journal of Contraception & Reproductive Health Care. Jan2026, p1-14. 14p. 4 Illustrations.

Development of a data-driven neural network model for electron thermal transport in NSTX.

Authors: Chung, H. Lee, C.Y. Choi, G.J. et al.

Source: Nuclear Fusion. Aug2025, Vol. 65 Issue 8, p1-14. 14p.

Subjects: Electron transport, Tokamaks, Plasma physics, Turbulent flow, Parameterization, Artificial neural networks, Plasma turbulence, Machine learning

Nesting chinstrap penguins accrue large quantities of sleep through seconds-long microsleeps.

Authors: Libourel, P.-A. Lee, W. Y. Achin, I. et al.

Source: Science (pre-March 2025). 12/1/2023, Vol. 382 Issue 6674, p1026-1031. 6p. 4 Diagrams.

Subjects: Sleep duration, Wakefulness, Slow wave sleep, Penguins, Sleep

Geographic Terms: Antarctica

The acquisition order of leukemic drug resistance mutations is directed by the selective fitness associated with each resistance mechanism.

Authors: Leow, Benjamin C. S. Kok, Chung H. Yeung, David T. et al.

Source: Scientific Reports. 11/20/2023, Vol. 13 Issue 1, p1-12. 12p.

Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer.

Authors: Chang, C. C. Chung, H. Y. Lai, Y. S.

Source: Journal of Electronic Materials; December 2010, Vol. 39 Issue 12, p2662-2668, 7p

Critical Current Density for Inhibiting (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints.

Authors: Wu, W. H. Chung, H. L. Chen, B. Z.

Source: Journal of Electronic Materials; December 2010, Vol. 39 Issue 12, p2653-2661, 9p

The Influence of Current Direction on the Cu-Ni Cross-Interaction in Cu/Sn/Ni Diffusion Couples.

Authors: Wu, W. H. Chung, H. L. Chen, C. N.

Source: Journal of Electronic Materials; December 2009, Vol. 38 Issue 12, p2563-2572, 10p

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A study of vacancies and vacancy pair defects in 4H SiC grown by halide chemical vapor deposition.

Authors: Zvanut, M. E. Ngetich, G. Chung, H. J.

Source: Journal of Materials Science: Materials in Electronics; Aug2008, Vol. 19 Issue 8/9, p678-681, 4p

Evolutionary design of static output feedback controller for Takagi-Sugeno fuzzy systems.

Authors: Chung, H. -Y. Wu, S.-M. Yu, F.-M.

Source: IET Control Theory & Applications; July 2007, Vol. 1 Issue 4, p1096-1103, 8p

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Experiments of Cold-Formed Steel Connections and Portal Frames.

Authors: Kwon, Y. B. Chung, H. S. Kim, G. D.

Source: Journal of Structural Engineering; April 2006, Vol. 132 Issue 4, p600-607, 8p

Biodegradable aliphatic polyester-poly (epichlorohydrin) blend/organoclay nanocomposites; synthesis and rheological characterization.

Authors: Lee, Chung H. Kim, Hee B. Lim, Sung T.

Source: Journal of Materials Science; August 2005, Vol. 40 Issue 15, p3981-3985, 5p

Fuzzy controller design for discrete controllability canonical Takagi-Sugeno fuzzy systems.

Authors: Chang, W.-J. Sun, C.-C. Chung, H.-Y.

Source: IEE Proceedings -- Control Theory & Applications; May2004, Vol. 151 Issue 3, p319-328, 10p

Nonlinear high-intensity discharge lamp model including a dynamic electrode voltage drop.

Authors: Yan, W. Hui, S. Y. R. Chung, H.

Source: IEE Proceedings -- Science, Measurement & Technology; July 2003, Vol. 150 Issue 4, p161-167, 7p

Status quo and predictions of the most and least discussed sustainable development goals.

Authors: Chung, H.-H. Chung, F.-L. Lin, S.-M.

Source: International Journal of Environmental Science & Technology (IJEST). Aug2025, Vol. 22 Issue 12, p11817-11826. 10p.

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Effect of constrained growth on defect structures in microgravity grown CdZnTe boules.

Authors: Raghothamachar, B. Chung, H. Dudley, M.

Source: Journal of Electronic Materials; June 1998, Vol. 27 Issue 6, p556-563, 8p

Effect of B on the microstructure and mechanical properties of mechanically milled TiAl alloys.

Authors: Kim, Sang H. Chung, H. H. Pyo, Sung G.

Source: Metallurgical & Materials Transactions. Part A; September 1998, Vol. 29A Issue 9, p2273-2283, 11p