Search Results - "Ding, Zifeng"

Preparation and electrochemical analysis of Cu–Mo coating.

Authors: Xu, Yimeng Ding, Zifeng Wei, Mengxia et al.

Source: Journal of Materials Science: Materials in Electronics; Apr2025, Vol. 36 Issue 12, p1-10, 10p

Calculation of Austenite Generalized Stacking Fault Energy in M50NiL Steel.

Authors: Ding, Zifeng Guo, Jiaxu Zhou, Lina et al.

Source: Materials (1996-1944). Mar2026, Vol. 19 Issue 6, p1170. 16p.

Research Progress on Sintered Micro-silver Paste for Power Electronic Packaging.

Authors: Li, Mulan Huang, Shijun Ding, Zifeng et al.

Source: Journal of Electronic Materials; Aug2025, Vol. 54 Issue 8, p6054-6068, 15p

Effect of Cu/Ga interfacial reaction on heat transfer performance.

Authors: Du, Xinyu Wang, Wendong Ding, Zifeng et al.

Source: Journal of Materials Science: Materials in Electronics; Jun2023, Vol. 34 Issue 17, p1-10, 10p

Sintering kinetics of silver joints: a semi-quantitative approach to predicting temperature-time sintering profiles.

Authors: Liu, Jingwen Mao, Huaming Yan, Maoyin et al.

Source: Journal of Materials Science: Materials in Electronics; May2026, Vol. 37 Issue 15, p1-17, 17p

Fabrication of liquid metal/diamond hybrid thermal interface materials with high thermal conductivity and low flowability.

Authors: Wang, Wendong Wei, Song Du, Xinyu et al.

Source: Journal of Materials Science: Materials in Electronics; Jun2023, Vol. 34 Issue 18, p1-16, 16p

Examining Narrative Patterns in Disinformation and Trustworthy News: A Comparative Analysis.

Authors: Mandravickaitė, Justina Krilavičius, Tomas

Source: Social Sciences (2076-0760). Apr2026, Vol. 15 Issue 4, p255. 32p.

A comparative study on the effect of SiC nanowires in stabilizing sintered Ag joints during long-term aging in air and vacuum.

Authors: Li, Mulan Huang, Shijun Ding, Zifeng et al.

Source: Vacuum; Jul2026, Vol. 250, pN.PAG-N.PAG, 1p

Selective ensemble method for anomaly detection based on parallel learning.

Authors: Liu, Yansong Zhu, Li Ding, Lei et al.

Source: Scientific Reports. 1/16/2024, Vol. 14 Issue 1, p1-21. 21p.