Search Results - "Electronic packaging"

Machine learning-driven multi-objective parameter optimization for sustainable, efficient, and high-quality ultrasonic wire bonding.

Authors: Buchner, Christoph Riedle, Benjamin Krauß, Jonas et al.

Source: Journal of Intelligent Manufacturing. Apr2026, Vol. 37 Issue 4, p1681-1699. 19p.

X-Ray Characterization of Semiconductor Materials and Advanced Packaging: A Perspective on Multidimensional Structural Analysis.

Authors: Jiang, Yumeng Zhang, Zhenwei An, Zhongyi et al.

Source: Crystals (2073-4352); Apr2026, Vol. 16 Issue 4, p265, 33p

Source: Gentherm Inc. MarketLine Company Profile. 3/12/2026, p1-28. 28p.

Subject Terms: *Automobile industry, *Thermal management (Electronic packaging)

Geographic Terms: United States

Company/Entity: Gentherm Inc.

Source: Pentair plc (formerly known as Pentair Ltd.) MarketLine Company Profile. 3/9/2026, p1-27. 27p.

Subject Terms: *Manufacturing industries, *Thermal management (Electronic packaging)

Geographic Terms: Switzerland

Company/Entity: Pentair Inc. 006451249 PNR

Enhancing Cu-Cu Stitch Bonding Reliability on Cu Leadframe Through Ultrathin Cu-Selective Passivation.

Authors: Nair, Shyam Muralidharan Perera, Duwage Anushka Sandaruwan Farmer, Gavin et al.

Source: Journal of Microelectronic & Electronic Packaging. 2026, Vol. 23 Issue 1, p9-17. 9p.

Subjects: Wire bonding (Electronic packaging), Microelectronic packaging, Packaging industry, Corrosion prevention

A 3D Vertically-Integrated Wideband Filter Antenna for X-Band Applications.

Authors: Fang, Tao Tang, Tao Zhao, Xiangyan et al.

Source: Progress in Electromagnetics Research C; 2026, Vol. 169, p106-114, 9p

SK Hynix Plans to Invest $13 Billion in New Chip Packaging Plant.

Authors: Lee, Yoolim Kim, Seyoon

Source: Bloomberg.com. 1/12/2026, pN.PAG-N.PAG. 1p.

Ni Thick Films with Compact Structure and Strong Adhesion Prepared with H 2 -Assitant RF Magnetron Sputtering at High Deposition Rate.

Authors: Bilal, Umar Li, Yangping Rana, Fizza et al.

Source: Coatings (2079-6412); Mar2026, Vol. 16 Issue 3, p279, 18p

Prediction of Activity of Au-Sn-Based Lead-Free Solder Using Modified Molecular Interaction Volume Model.

Authors: Wu, Hai Chen, Liangliang Zhu, Liguo et al.

Source: Metals (2075-4701); Mar2026, Vol. 16 Issue 3, p330, 16p

Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires.

Authors: Yang, Wenxiang Zhang, Yong Cheng, Xianzhe et al.

Source: Applied Sciences (2076-3417); Jan2026, Vol. 16 Issue 2, p949, 29p

Chemical Mechanical Polishing of Plasma‐Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding.

Authors: Kang, Sukkyung Jeon, Chansu Park, Juseong et al.

Source: Advanced Science. 1/14/2026, Vol. 13 Issue 3, p1-10. 10p.

Microstructures and Mechanical Properties of TiC-Reinforced Red Mud–Alumina Composite Ceramics.

Authors: Wang, Zhengliang Li, Anmin Shi, Yunchuan

Source: Crystals (2073-4352); Jan2026, Vol. 16 Issue 1, p15, 15p

The Electromagnetic Shielding Effectiveness of Polypropylene Nanocomposite Filled with Graphene.

Authors: Al-Tweissi, Mohammed Hussein, Omer

Source: Journal of Nano- & Electronic Physics; 2026, Vol. 18 Issue 1, p01006-1-01006-5, 5p

Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits.

Authors: Liang, Chaofan Tian, Chongxin Zhang, Yanmei et al.

Source: Materials (1996-1944). Nov2025, Vol. 18 Issue 22, p5154. 21p.

Subjects: Solder pastes, Electronic packaging, Stencil printing, Laser deposition, Viscoelasticity

Cu-Contamination-Free Hybrid Bonding via MoS 2 Passivation Layer.

Authors: Choi, Hyunbin Kim, Kyungman Son, Sihoon et al.

Source: Nanomaterials (2079-4991). Oct2025, Vol. 15 Issue 20, p1600. 11p.

Subjects: Molybdenum disulfide, Electronic packaging, Plasma materials processing, Copper films, Memristors, Integrated circuit interconnections, Sealing (Technology)

Research on Zero Value Effect of Positive and Negative Thermal Expansion Mixed Ceramic Fillers and Its Application in BT Resin‐Based Composites.

Authors: Zhou, Zikang Liang, Fei Zeng, Yuyao et al.

Source: Polymer Composites. 12/10/2025, Vol. 46 Issue 17, p16302-16310. 9p.

Effect of Current Density on Shear Performance and Fracture Behavior of Cu/Sn-58Bi/Cu Solder Joints.

Authors: Pan, Kailin Chen, Zimeng Liu, Menghao et al.

Source: Crystals (2073-4352); Nov2025, Vol. 15 Issue 11, p945, 18p

Source: Gentherm Inc. MarketLine Company Profile. 9/5/2025, p1-28. 28p.

Subject Terms: *Automobile industry, *Thermal management (Electronic packaging)

Geographic Terms: United States

Company/Entity: Gentherm Inc.

Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging.

Authors: Muhamed Mukhtar, Muhamed Abdul Fatah Phang, Jia Xin Abd Khalid, Nor Rashikin et al.

Source: Soldering & Surface Mount Technology. 2026, Vol. 38 Issue 3, p205-215. 11p.

Multiscale Finite Element Analysis of Warping Suppression in Microelectronics with Graded SiC/Al Composites.

Authors: Zhao, Junfeng Zhang, Junliang Su, Hao et al.

Source: Materials (1996-1944). Aug2025, Vol. 18 Issue 16, p3788. 13p.

Subjects: Microelectronics, Electronic packaging, Finite element method, Mechanical failures, Thermocycling, Strains & stresses (Mechanics), Cyclic loads, Composite materials