Search Results - "Kim, Hak-Sung"

Sensitivity Analysis of Numerical Coherency Model for Rock Sites.

Authors: Lee, Dongyeon Lee, Yonghee Kim, Hak-Sung et al.

Source: Applied Sciences (2076-3417); Mar2025, Vol. 15 Issue 6, p2925, 12p

Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging.

Authors: Baek, Keuntae Kim, Minhyeok Kim, Hak‐Sung et al.

Source: Advanced Materials Technologies; 10/7/2025, Vol. 10 Issue 19, p1-30, 30p

Effect of Nonlinear Soil Model on Seismic Response of Slopes Composed of Granular Soil.

Authors: Lee, Yonghee Kim, Hak-Sung Khalid, Muhammad Irslan et al.

Source: Advances in Civil Engineering; 11/23/2020, p1-11, 11p

Multi-scale (Macro-Meso-Micro) Progressive Failure Simulation of the Carbon Fiber Braided Structure Under Quasi-static Mechanical Loading.

Authors: Lee, Se-Min Baek, Jeong-Hyeon Yu, Myeong-Hyeon et al.

Source: International Journal of Precision Engineering & Manufacturing-Green Technology; Sep2025, Vol. 12 Issue 5, p1501-1520, 20p

Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste.

Authors: Ju, Young-Min Kim, Tae-Wan Lee, Seung-Hyun et al.

Source: Nano Convergence; 7/23/2025, Vol. 12 Issue 1, p1-53, 53p

Effect of Characteristics of Ground Motion on Seismically Induced Sliding Surface of Slopes.

Authors: Khalid, Muhammad Irslan Lee, Yonggook Lee, Yonghee et al.

Source: Applied Sciences (2076-3417); Jun2021, Vol. 11 Issue 12, p5319, 14p

Influence of an abnormally cold stratospheric polar vortex on the sub-regional PM2.5 anomaly in East Asia in March of 2021.

Authors: Cho, Jae-Hee Kim, Hak-Sung

Source: NPJ Climate & Atmospheric Science. 12/19/2024, Vol. 7 Issue 1, p1-14. 14p.

A review on water jet-sediment coupling and critical techniques during deep-sea polymetallic nodules collection.

Authors: Sha, Fei Niu, Hongying Yang, Kairui et al.

Source: Marine Georesources & Geotechnology; Sep2025, Vol. 43 Issue 9, p1828-1861, 34p

Inkjet printed electronics using copper nanoparticle ink.

Authors: Kang, Jin Sung Kim, Hak Sung Ryu, Jongeun

Source: Journal of Materials Science: Materials in Electronics; November 2010, Vol. 21 Issue 11, p1213-1220, 8p

Spatial coherency analysis of seismic motions from a hard rock site dense array in Busan, Korea.

Authors: Lee, Yonghee Lee, Dongyeon Kim, Hak-Sung et al.

Source: Bulletin of Earthquake Engineering. Dec2024, Vol. 22 Issue 15, p7235-7259. 25p.

Subject Terms: *Ground motion, *Seismic waves, *Rock music, *Seismograms, *Motion analysis

In-situ non-contact monitoring of photoresist thickness and degree of cure using terahertz time-domain spectroscopy.

Authors: Kim, Sang-Il Kim, Hak-Sung

Source: NDT & E International; Jan2026, Vol. 157, pN.PAG-N.PAG, 1p

Thermal characteristics of resistive heating composite panels for the interior parts of railway vehicles.

Authors: Park, Juyeop Kang, Donghoon Kim, Hak-Sung

Source: Advanced Composite Materials. Feb2025, Vol. 34 Issue 1, p16-33. 18p.

Depth Gradient Reduced Graphene Oxide Layer via Intense Pulsed Light Annealing Process for the Flexible Resistive Random Access Memory Device.

Authors: Park, Jong‐Whi Moon, Chang‐Jin Ju, Young‐Min et al.

Source: Advanced Electronic Materials; Mar2022, Vol. 8 Issue 3, p1-10, 10p

Dendrimer‐Like Supramolecular Assembly of Proteins with a Tunable Size and Valency Through Stepwise Iterative Growth.

Authors: Bae, Jin‐Ho Kim, Hong‐Sik Kim, Gijeong et al.

Source: Advanced Science; Dec2021, Vol. 8 Issue 24, p1-10, 10p

Anti-obesity effects of Lactiplantibacillus plantarum SKO-001 in high-fat diet-induced obese mice.

Authors: Choi, Mi Jin Yu, Hana Kim, Jea Il et al.

Source: European Journal of Nutrition. Jun2023, Vol. 62 Issue 4, p1611-1622.

Computer-guided binding mode identification and affinity improvement of an LRR protein binder without structure determination.

Authors: Choi, Yoonjoo Jeong, Sukyo Choi, Jung-Min et al.

Source: PLoS Computational Biology. 8/31/2020, Vol. 16 Issue 8, p1-17. 17p. 1 Chart, 5 Graphs.

Near-IR sintering of conductive silver nanoparticle ink with in situ resistance measurement.

Authors: Keller, David J. Jochem, Krystopher S. Suszynski, Wieslaw J. et al.

Source: Journal of Coatings Technology & Research; Nov2019, Vol. 16 Issue 6, p1699-1705, 7p

In-situ thickness measurement of epoxy molding compound in semiconductor package products using a Terahertz-Time of Flight System.

Authors: Park, Dong-Woon Oh, Gyung-Hwan Kim, Dug-Joong et al.

Source: NDT & E International; Jul2019, Vol. 105, p11-18, 8p

Electron density measurement of Ar, N2, O2, and Ar mixtures (with N2 and O2) gas in inductively coupled plasma (ICP) using terahertz time domain spectroscopy.

Authors: Kim, Sang-Il Park, Dong-Woon Kim, Heon-Su et al.

Source: Optics & Laser Technology; Jan2025, Vol. 180, pN.PAG-N.PAG, 1p

Development of a via-hole connection process via intense pulsed light sintering with Cu micro/Ag nano-hybrid ink for a multi-layered flexible printed circuit board.

Authors: Chu, Ji-Hyeon Joo, Sung-Jun Kim, Hak-Sung

Source: Thin Solid Films; Jun2019, Vol. 680, p1-11, 11p