Search Results - "Koh S"

Forecasting the ecological footprint of G20 countries in the next 30 years.

Authors: Eufrasio Espinosa, Rafael M. Lenny Koh, S. C.

Source: Scientific Reports. 4/9/2024, Vol. 14 Issue 1, p1-13. 13p.

Heat pump supply chain environmental impact reduction to improve the UK energy sustainability, resiliency and security.

Authors: Shamoushaki, Moein Koh, S. C. Lenny

Source: Scientific Reports. 11/23/2023, Vol. 13 Issue 1, p1-12. 12p.

Application of reversible variable-length codes in robust speech coding.

Authors: Wang, H. Koh, S. N. Chang, W.-W.

Source: IEE Proceedings -- Communications; June 2005, Vol. 152 Issue 3, p272-276, 5p

Achieving carbon neutrality via supply chain management: position paper and editorial for IJPR special issue.

Authors: Koh, S. C. Lenny Jia, Fu Gong, Yu et al.

Source: International Journal of Production Research. Sep2023, Vol. 61 Issue 18, p6081-6092. 12p. 1 Graph.

Subjects: Supply chain management, Carbon offsetting, Supply chains

Assessing pre-pandemic carbon footprint of diet transitions in UK nations and regions.

Authors: Ali, Mustafa Koh, S. C. Lenny Liu, Lingxuan et al.

Source: International Journal of Production Research. Sep2023, Vol. 61 Issue 18, p6115-6130. 16p. 2 Charts, 4 Graphs.

Subjects: Ecological impact, Consumption (Economics), Food consumption, Diet, Food supply, Carbon emissions, Greenhouse gases, Local foods

Geographic Terms: United Kingdom

Heat Transfer Enhancement by Hybrid Nano Additives—Graphene Nanoplatelets/Cellulose Nanocrystal for the Automobile Cooling System (Radiator).

Authors: Yaw, Chong Tak Koh, S. P. Sandhya, M. et al.

Source: Nanomaterials (2079-4991). Mar2023, Vol. 13 Issue 5, p808. 28p.

Subjects: Nanofluids, Cellulose nanocrystals, Heat transfer, Heat transfer coefficient, Nanoparticles, Heat convection, Radiators, Forced convection

Design and tests of the new partially ionized beam source.

Authors: Koh, S. K. Jang, H. G. Choi, W. K.

Source: Review of Scientific Instruments; December 1996, Vol. 67, p4114-4116, 3p

CHELLO: The Child/Home Environmental Language and Literacy Observation

Authors: Neuman, S.B Koh, S. Dwyer, J.

Source: Early Childhood Research Quarterly. 2008 23(2):159-172.

Peer Reviewed: Y

Page Count: 14

Descriptors: Observation, Interrater Reliability, Urban Areas, Psychometrics, Emergent Literacy, Validity, Reliability, Family Environment, Evaluation Methods, Check Lists, Interviews, Low Income, Language Acquisition, Environmental Influences

High Intensity Cycling Performances of Boys with and without Intellectual Disability.

Authors: Chia, Y. H. M. Lee, K. S. Teo-Koh, S. M.

Source: Journal of Intellectual and Developmental Disability. Sep 2002 27(3):191-200.

Peer Reviewed: Y

Page Count: 10

Descriptors: Adolescents, Bicycling, Exercise, Exercise Physiology, Males, Medical Research, Mental Retardation, Secondary Education, Test Reliability

Journal Code: CIJMAR2003

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Refractory status epilepticus secondary to Neurexin-3α encephalitis: A case report.

Authors: Koh, S. J. Ang, C. H. Tham, H. L. C. et al.

Source: Neurology Asia. Sep2018, Vol. 23 Issue 3, p273-277. 5p.

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Effect of Microstructure on Hydrogen-Induced Cracking of Linepipe Steels.

Authors: Koh, S. U. Jung, H. G. Kang, K. B.

Source: Corrosion; July 2008, Vol. 64 Issue 7, p574-585, 12p

Effect of Molybdenum and Chromium Addition on the Susceptibility to Sulfide Stress Cracking of High-Strength, Low-Alloy Steels.

Authors: Koh, S. U. Lee, J. M. Yang, B. Y.

Source: Corrosion; March 2007, Vol. 63 Issue 3, p220-230, 11p

The use of intelligent feedback for work order release in an uncertain manufacturing system.

Authors: Koh, S. C. L. Saad, S. M.

Source: Robotics & Computer-Integrated Manufacturing; Dec2004, Vol. 20 Issue 6, p517-527, 11p

Effect of Line Pipe Steel Microstructure on Susceptibility to Sulfide Stress Cracking.

Authors: Koh, S. U. Kim, J. S. Yang, B. Y.

Source: Corrosion; March 2004, Vol. 60 Issue 3, p244-253, 10p

Effect of Alloying Elements on the Susceptibility to Sulfide Stress Cracking of Line Pipe Steels.

Authors: Koh, S. U. Yang, B. Y. Kim, K. Y.

Source: Corrosion; March 2004, Vol. 60 Issue 3, p262-274, 13p

Surface Planarization of Strain-Relaxed SiGe Buffer Layers by CMP and Post Cleaning.

Authors: Sawano, K. Kawaguchi, K. Koh, S.

Source: Journal of the Electrochemical Society; July 2003, Vol. 150 Issue 7, pG376-G379, 4p

MRP-controlled manufacturing environment disturbed by uncertainty.

Authors: Koh, S. C. L. Saad, S. M.

Source: Robotics & Computer-Integrated Manufacturing; February/April 2003, Vol. 19 Issue 1/2, p157-171, 15p

The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging.

Authors: Wong, E. H. Rajoo, R. Koh, S. W.

Source: Journal of Electronic Packaging; June 2002, Vol. 124 Issue 2, p122-126, 5p