Search Results - "Lin Y"

Ultrasound-guided paravertebral nerve block for pain management in pediatric patients undergoing radiotherapy for mediastinal tumors.

Authors: Lin, Y. Qu, T. F. Li, S. et al.

Source: International Journal of Radiation Research. Jan2026, Vol. 24 Issue 1, p199-204. 6p.

COMPREHENSIVE ANALYSIS OF ENVIRONMENTAL FACTORS AFFECTING THE SURVIVAL OF MANGROVE SEEDLINGS AND CARBON STORAGE IN SANYA, HAINAN PROVINCE, CHINA: THE COMBINED IMPACTS OF PESTICIDE POLLUTION, EUTROPHICATION, AND ECOLOGICAL DEGRADATION.

Authors: LIN, Y. W. LIU, R. N. SHI, Y. F. et al.

Source: Applied Ecology & Environmental Research. 2025, Vol. 23 Issue 6, p10479-10496. 18p.

Characterization of binder and mix properties to detect reclaimed asphalt pavement content in bituminous mixtures.

Authors: Chen, J. S. Chu, P. Y. Lin, Y. Y.

Source: Canadian Journal of Civil Engineering; May 2007, Vol. 34 Issue 5, p581-588, 8p

MHAED-Net: a lightweight multiscale hybrid attention encoder-decoder network for the efficient segmentation of industrial forging images.

Authors: Wan, Miao Lin, Y. C. Li, Shu-Xin et al.

Source: Journal of Supercomputing; Jun2025, Vol. 81 Issue 8, p1-36, 36p

An Interactive Visual Enhancement for Prompted Programmatic Weak Supervision in Text Classification.

Authors: Lin, Y. Wei, S. Zhang, H. et al.

Source: Computer Graphics Forum; Jun2025, Vol. 44 Issue 3, p1-11, 11p

EFFECT OF DIFFERENT IRRIGATION AMOUNT AND STRAW RETURNING AMOUNT ON GLOBAL WARMING POTENTIAL OF PADDY IN COLD REGIONS.

Authors: LIN, Y. Y. YI, S. J. ZHENG, X. et al.

Source: Applied Ecology & Environmental Research. 2025, Vol. 23 Issue 3, p5193-5208. 16p.

Ultralow subthreshold swing of 9 mV/dec for planar bulk GaAs MOSFETs at 4 K in quantum computing applications.

Authors: Young, L. B. Lin, Y. H. G. Wan, H. W. et al.

Source: APL Electronic Devices. Mar2025, Vol. 1 Issue 1, p1-8. 8p.

Experimental and Numerical Investigation on Dynamic Responses of Steel Targets Subjected to Hypervelocity Impacts.

Authors: Ma, J. Huang, W. Yize, K. et al.

Source: Experimental Mechanics; Jul2026, Vol. 66 Issue 6, p1079-1103, 25p

Theme 3 In Vitro Experimental Models.

Authors: Lin, Y. H. Dodd, J. Castelli, L. et al.

Source: Amyotrophic Lateral Sclerosis & Frontotemporal Degeneration. 2024 Suppl 1, Vol. 25, p122-135. 14p.

Coronavirus pandemic derived demands and inclusive leadership on junior doctors' well-being.

Authors: Lin, Y K Lin, B Y-J

Source: Occupational Medicine. Nov2024, Vol. 74 Issue 8, p589-595. 7p.

AGE-RELATED CHANGES IN SOIL AND MICROBIAL C:N:P STOICHIOMETRY IN ZENIA INSIGNIS PLANTATIONS IN KARST REGIONS OF SOUTHWEST CHINA.

Authors: HU, G. LIN, Y. HU, C. et al.

Source: Applied Ecology & Environmental Research. 2024, Vol. 22 Issue 6, p6003-6016. 14p. 1 Diagram, 2 Charts, 2 Graphs, 1 Map.

Optimal Pose Guidance for Stereo Calibration in 3D Deformation Measurement.

Authors: Tan, D. Liang, S. Li, B. et al.

Source: Experimental Mechanics; Mar2026, Vol. 66 Issue 3, p501-514, 14p

Global Distribution and Seasonal Variation of Transient Luminous Events Observed by ISUAL Over 12 Years.

Authors: Lin, Y. C. Chen, A. B. Chuang, C. W. et al.

Source: Journal of Geophysical Research. Space Physics. Feb2026, Vol. 131 Issue 2, p1-16. 16p.

Subject Terms: *Upper atmosphere, Atmospheric electricity, Spatial analysis (Statistics), Imaging systems

Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints.

Authors: Tsai, M. Y. Lin, Y. L. Lin, Y. W.

Source: Journal of Electronic Materials; December 2010, Vol. 39 Issue 12, p2528-2535, 8p

Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration.

Authors: Lin, Y. L. Lai, Y. S. Lin, Y. W.

Source: Journal of Electronic Materials; January 2008, Vol. 37 Issue 1, p96-101, 6p

Tin Whisker Growth Induced by High Electron Current Density.

Authors: Lin, Y. W. Lai, Yi-Shao Lin, Y. L.

Source: Journal of Electronic Materials; January 2008, Vol. 37 Issue 1, p17-22, 6p

Effects of the Gold Thickness of the Surface Finish on the Interfacial Reactions in Flip-Chip Solder Joints.

Authors: Lin, Y. L. Luo, W. C. Lin, Y. H.

Source: Journal of Electronic Materials; Oct2004, Vol. 33 Issue 10, p1092-1097, 6p

Hands-On Learning: An Experiential Approach to Train Chemical Engineering Students

Authors: Gautam, Satyen Nagarajan, Karthiga Loh, Kai Chee et al.

Source: Chemical Engineering Education. Spr 2020 54(2):72-82.

Peer Reviewed: Y

Page Count: 11

Descriptors: Experiential Learning, Chemical Engineering, Engineering Education, Undergraduate Students, Teaching Methods, Course Descriptions, Laboratory Experiments, Hands on Science, Instructional Effectiveness, Student Centered Learning, Mastery Learning, Student Attitudes, Course Evaluation, Feedback (Response), Thinking Skills, Skill Development, Educational Quality, Student Evaluation, Evaluation Methods, Critical Thinking, Foreign Countries

Geographic Terms: Singapore

Access URL: https://journals.flvc.org/cee/article/view/116239

RouteVis: Quantitative Visual Analytics of Various Factors to Understand Route Choice Preferences.

Authors: Lv, C. Zhang, H. Lin, Y. et al.

Source: Computer Graphics Forum; Jun2024, Vol. 43 Issue 3, p1-12, 12p

Investigating neonatal health risk variables through cell-type specific methylome-wide association studies.

Authors: Campbell, Thomas L. Xie, Lin Y. Johnson, Ralen H. et al.

Source: Clinical Epigenetics. 5/22/2024, Vol. 16 Issue 1, p1-8. 8p.