Search Results - "Luu DB"

Effect of technological parameters on mechanical properties and microstructure of heat-assisted friction stir welded joints of 6061 aluminum alloy.

Authors: Nguyen HL Pham VT Luu DB et al.

Source: PloS one [PLoS One] 2025 Oct 22; Vol. 20 (10), pp. e0334979. Date of Electronic Publication: 2025 Oct 22 (Print Publication: 2025).

Publication Type: Journal Article

Journal Info: Publisher: Public Library of Science Country of Publication: United States NLM ID: 101285081 Publication Model: eCollection Cited Medium: Internet ISSN: 1932-6203 (Electronic) Linking ISSN: 19326203 NLM ISO Abbreviation: PLoS One Subsets: MEDLINE

The constant/variable kinematics adjustment of the crosshead and the mold's stability management in injection molding.

Authors: Zhao, Nan-yang Xu, Zhong-bin Shan, Yan et al.

Source: International Journal of Advanced Manufacturing Technology. Jul2024, Vol. 133 Issue 1/2, p901-912. 12p.

A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics.

Authors: Bharath Krupa Teja, Mekala Sharma, Ashutosh Das, Siddhartha et al.

Source: Journal of Materials Science; May2022, Vol. 57 Issue 19, p8597-8633, 37p, 2 Black and White Photographs, 1 Diagram, 10 Charts, 5 Graphs, 2 Maps

Effects of Zn contents on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi-based lead-free solder.

Authors: Li, Yulong Lin, Wei Li, Xuewen et al.

Source: Journal of Materials Science: Materials in Electronics; Feb2022, Vol. 33 Issue 4, p1741-1751, 11p

The effect of alkaline earth additions on the physical property and the corrosion behavior of Sn-0.7Cu-0.075Al solder alloy.

Authors: Qi, Da Du, Zaixiang Fu, Yaokun et al.

Source: Journal of Materials Science: Materials in Electronics; Oct2021, Vol. 32 Issue 19, p24152-24167, 16p

Leveraging prior strain rates effect during stress relaxation of Sn–1.7Ag–0.7Cu lead-free alloys with microalloying of Te and Co for microelectronics applications.

Authors: El-Daly, A. A. Zohdy, K. M. Abdo, M. A. et al.

Source: Journal of Materials Science: Materials in Electronics; Jul2019, Vol. 30 Issue 14, p13757-13767, 11p

Viscoplastic characterization and mechanical strength of novel Sn–1.7Ag–0.7Cu lead-free solder alloys with microalloying of Te and Co.

Authors: El-Daly, A. A. Ibrahiem, A. A. Abdo, M. A. et al.

Source: Journal of Materials Science: Materials in Electronics; Jul2019, Vol. 30 Issue 14, p12937-12949, 13p

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy.

Authors: Tao, Q.B. Benabou, L. Le, Van Nhat et al.

Source: Fatigue & Fracture of Engineering Materials & Structures. Dec2020, Vol. 43 Issue 12, p2883-2891. 9p.