Search Results - "Nishimura T"

Effects of vanadium on the properties of Sn-3wt%Ag-5wt%Cu solder alloy.

Authors: Tan, C. Y. Mohd Salleh, M. A. A. Saud, N. et al.

Source: Journal of Materials Science: Materials in Electronics; Jul2024, Vol. 35 Issue 20, p1-12, 12p

Cracking and Phase Stability in Reaction Layers between Sn-Cu-Ni Solders and Cu Substrate.

Authors: Nogita, K. Gourlay, C. M. Nishimura, T.

Source: JOM: The Journal of The Minerals, Metals & Materials Society (TMS); June 2009, Vol. 61 Issue 6, p45-51, 5p

Compressive creep behaviour of Yb4Si2O7N2 containing silicon nitride ceramic between 1400 and 1500°C.

Authors: Guo, S. Hirosaki, N. Nishimura, T.

Source: Materials Science & Technology; April 2003, Vol. 19 Issue 4, p544-548, 5p

Mechanical and thermal properties of Si-C-N material from polyvinylsilazane.

Authors: Nishimura, T. Haug, R. Bill, J.

Source: Journal of Materials Science; November 1 1998, Vol. 33 Issue 21, p5237-5241, 5p

Consolidation and high‐temperature properties of ceramics in the TaC–NbC system.

Authors: Demirskyi, Dmytro Nishimura, T. Suzuki, T. S. et al.

Source: Journal of the American Ceramic Society; Dec2022, Vol. 105 Issue 12, p7567-7581, 15p, 6 Black and White Photographs, 2 Charts, 10 Graphs

Liquid/Solid Interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu Dissimilar Joints during Soldering at Low Temperature by In-Situ Synchrotron Imaging.

Authors: Ramli, M. I. I. Salleh, M. A. A. Mohd Nishimura, T. et al.

Source: JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jul2022, Vol. 74 Issue 7, p2760-2769, 10p

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The slow earthquake spectrum in the Japan Trench illuminated by the S-net seafloor observatories.

Authors: Nishikawa, T. Matsuzawa, T. Ohta, K. et al.

Source: Science (pre-March 2025). 8/23/2019, Vol. 365 Issue 6455, p808-813. 6p. 4 Diagrams.

Subjects: Earthquakes, Pacific Plate, Okhotsk culture, Earthquake swarms

Geographic Terms: Japan Trench, Japan

Precipitation and coarsening of bismuth plates in Sn-Ag-Cu-Bi and Sn-Cu-Ni-Bi solder joints.

Authors: Belyakov, S. A. Xian, J. Zeng, G. et al.

Source: Journal of Materials Science: Materials in Electronics; Jan2019, Vol. 30 Issue 1, p378-390, 13p

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Atomic scale characterization of HfO2/Al2O3 thin films grown on nitrided and oxidized Si substrates.

Authors: Nishimura, T. Okazawa, T. Hoshino, Y.

Source: Journal of Applied Physics; 12/1/2004, Vol. 96 Issue 11, p6113-6119, 7p

Mass-Transfer Enhancement in a Wavy-Walled Tube by Imposed Fluid Oscillation.

Authors: Nishimura, T. Bian, Y. N. Kunitsugu, K.

Source: AIChE Journal; Apr2004, Vol. 50 Issue 4, p762-770, 9p

The structure of plumes generated in the unidirectional solidification process for a binary system.

Authors: Nishimura, T. Sasaki, J. Htoo, T. T.

Source: International Journal of Heat & Mass Transfer; November 2003, Vol. 46 Issue 23, p4489-4497, 9p

Thermal decomposition behavior of the HfO2/SiO2/Si system.

Authors: Sayan, S. Garfunkel, E. Nishimura, T.

Source: Journal of Applied Physics; July 15 2003, Vol. 94 Issue 2, p928-934, 7p

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Electrochemical behavior of rust formed on carbon steel in a wet/dry environment containing chloride ions.

Authors: Nishimura, T. Katayama, H. Noda, K.

Source: Corrosion; September 2000, Vol. 56 Issue 9, p935-941, 7p