Search Results - "Three-dimensional integrated circuits"

A novel approach for performance improvements of TSV and TTSV of 3D IC through thermoelectric effect and mechanical reliability analysis.

Authors: Chaudhuri, Debika Rahaman, Hafizur Ghosh, Tamal

Source: Sādhanā: Academy Proceedings in Engineering Sciences. Jun2026, Vol. 51 Issue 2, p1-10. 10p.

Subjects: Through-silicon via, Three-dimensional integrated circuits, Reliability in engineering, Thermoelectric effects, Finite element method, Thermal stresses

THERMAL OPTIMIZATION OF THE 3-D INTEGRATED CIRCUITS WITH FRACTAL MICRO-CHANNELS.

Authors: WANG, Kang-Jia LIU, Wen-Jing

Source: Thermal Science. 2026, Vol. 30 Issue 3B, p2129-2140. 12p.

Subjects: Three-dimensional integrated circuits, Cooling, Temperature control equipment, Computational fluid dynamics

Numerical Study of the Impact of Inter-Die Thermal Conductance on the Thermal Performance of 3D ICs Cooled by a Single-Layer Microchannel Heat Exchanger.

Authors: Zając, Piotr Zabierowski, Wojciech

Source: Energies (19961073). Dec2025, Vol. 18 Issue 23, p6150. 18p.

Subjects: Three-dimensional integrated circuits, Heat exchangers, Multichip modules (Microelectronics), Numerical analysis, Cooling loads (Mechanical engineering), Cooling systems, Thermal conductivity

INNOVATIVE THERMAL APPROACHES TO FAULT ISOLATION IN THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES.

Authors: Norimichi Chinone Shimpei Tominaga

Source: Electronic Device Failure Analysis. Nov2025, Vol. 27 Issue 4, p4-11. 8p.

Subjects: Three-dimensional integrated circuits, Fault diagnosis, Integrated circuit interconnections, Semiconductor manufacturing, Thermography, Semiconductor storage devices

Chiplet-Technologie auf dem Vormarsch.

Source: Elektronik Industrie. 11/12/2025, Issue 11, p22-25. 4p.

CU-CU MECHANICAL BONDING FOR 3D INTEGRATION OF THE NEXT GENERATION ELECTRONIC CHIPS: INTERFACIAL MECHANISMS, SURFACE ENGINEERING, AND EMERGING LOW-TEMPERATURE STRATEGIES.

Authors: Choi, Sooyong Chen, Chih-Ming Hwang, Byungil

Source: Facta Universitatis, Series: Mechanical Engineering. Dec2025, Vol. 23 Issue 4, p921-943. 23p.

Flexible three-dimensional integrated circuits (3D ICs) based on liquid metal.

Authors: Tian, Ruiwen Chen, Jianhui Zhu, Ming et al.

Source: Wearable Electronics. Dec2025, Vol. 2, p1-17. 17p.

The Impact of Process Variations on the Thermo-Mechanical Behavior of 3D Integrated Circuits.

Authors: Chan, Yi-Cheng Liao, Ming-Han Yao, Chun-Wei

Source: Applied Sciences (2076-3417); Sep2025, Vol. 15 Issue 17, p9847, 13p

SnO Nanosheet Transistor with Remarkably High Hole Effective Mobility and More than Six Orders of Magnitude On-Current/Off-Current.

Authors: Chen, Kuan-Chieh Wu, Jiancheng Pooja, Pheiroijam et al.

Source: Nanomaterials (2079-4991). May2025, Vol. 15 Issue 9, p640. 15p.

Subjects: Three-dimensional integrated circuits, Surface passivation, Hole mobility, X-ray photoelectron spectroscopy, Passivation, Metal oxide semiconductor field-effect transistors

Low-Temperature Cu–Cu Bonding in Ambient Air via Glycerol-Assisted Sintering of Cu Nanowire Arrays.

Authors: Jiang, H. Zhu, Y. B. Xu, Y. H.

Source: Journal of Electronic Materials. Feb2026, Vol. 55 Issue 2, p1582-1594. 13p.

Subjects: Glycerin, Three-dimensional integrated circuits, Shear strength, Oxidation-reduction reaction, Atmosphere, Metal bonding, Sintering, Nanostructures

Monolithic three-dimensional integration of silicon transistors.

Authors: Lam, Bao Yu, Yung Man Nam, Hyunjun et al.

Source: Nature. May2026, p1-8. 8p.

Thermal analysis of 3D GPU-memory architectures with boron nitride interposer.

Authors: Wang, Eric Han Yan, Weijia Huang, Ruihong

Source: MRS Communications; Apr2026, Vol. 16 Issue 2, p537-542, 6p

A NOVEL HEAT DISSIPATION STRUCTURE WITH EMBEDDED BOTH THROUGH SILICON VIAS AND MICRO-CHANNELS FOR IMPROVING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS.

Authors: Peng XU Huan HUANG Fa ZOU et al.

Source: Thermal Science. 2025, Vol. 29 Issue 2B, p873-887. 15p.

Subjects: Three-dimensional integrated circuits, Heat transfer, Filler materials, Steady-state responses, Copper

THE ADOPTION OF NOVEL COOLING LIQUIDS FOR ENHANCING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS WITH EMBEDDED MICRO-CHANNEL.

Authors: Huan HUANG Chun SHAN Futang LONG et al.

Source: Thermal Science. 2025, Vol. 29 Issue 1A, p227-250. 24p.

Subjects: Three-dimensional integrated circuits, Nanofluids, Heat transfer fluids, Heat transfer, Microchannel flow, Liquid metals, Microfluidic devices, Liquids

Image Processing-Based Method of Evaluation of Stress from Grain Structures of Through Silicon Via (TSV).

Authors: Sharma, Manvinder Saripalli, Sudhakara Reddy Gupta, Anuj Kumar et al.

Source: International Journal of Image & Graphics. Mar2025, Vol. 25 Issue 2, p1-28. 28p.

Quest for more Moore at the end of Device Downsizing.

Authors: Wong, Hei Zhang, Jieqiong Liu, Jun

Source: Journal of Circuits, Systems & Computers. 11/15/2025, Vol. 34 Issue 16, p1-22. 22p.

Subjects: Moore's law, Three-dimensional integrated circuits, Field-effect transistors, Complementary metal oxide semiconductors, Thin film transistors, Moore, Gordon E., 1929-, Technological innovations, Integrated circuits

From planar to stacked: a comparative analysis of 2D and 3D ICs from the perspective of architecture, performance, and fabrication.

Authors: R.C, Radha Sangli, Mihir Sripad, Spoorthi et al.

Source: Analog Integrated Circuits & Signal Processing. Nov2025, Vol. 125 Issue 2, p1-15. 15p.

Subjects: Three-dimensional integrated circuits, Semiconductor industry, Fabrication (Manufacturing), Mechanical efficiency, Heating control, Energy consumption, Computer architecture

Semiconductor wafer singulation: technological advancements and emerging trends.

Authors: Lim, Dao Kun Che, Fa Xing Vempaty, Venkata Rama Satya Pradeep et al.

Source: Critical Reviews in Solid State & Materials Science. Oct2025, p1-41. 41p. 32 Illustrations.

AN EQUIVALENT THERMAL CONDUCTIVITY MODEL OF THROUGH SILICON VIA ARRAYS FOR THERMAL ANALYSIS IN 3-D INTEGRATED CIRCUITS.

Authors: Zhao-Pei XU Kang-Jia WANG

Source: Thermal Science. 2024, Vol. 28 Issue 5B, p4081-4088. 8p.

Subjects: Three-dimensional integrated circuits, Thermal conductivity, Integrated circuit design, Thermal analysis, Moore's law, Finite element method, Thermal management (Electronic packaging), Integrated circuits

Routing Algorithm Based on Obstacle-Avoiding Rectilinear Steiner Minimum Tree for Three-Dimensional Integrated Circuit.

Authors: Li, Zhensong Wen, Hao

Source: Journal of Circuits, Systems & Computers. Mar2026, p1. 18p. 14 Illustrations.