APA (7th ed.) Citation

Jung, D. H., Sharma, A., & Jung, J. P. (2018). A review of soft errors and the low α-solder bumping process in 3-D packaging technology. Journal of Materials Science, 53(1), 47. https://doi.org/10.1007/s10853-017-1421-y

Chicago Style (17th ed.) Citation

Jung, D. H., A. Sharma, and J. P. Jung. "A Review of Soft Errors and the Low α-solder Bumping Process in 3-D Packaging Technology." Journal of Materials Science 53, no. 1 (2018): 47. https://doi.org/10.1007/s10853-017-1421-y.

MLA (9th ed.) Citation

Jung, D. H., et al. "A Review of Soft Errors and the Low α-solder Bumping Process in 3-D Packaging Technology." Journal of Materials Science, vol. 53, no. 1, 2018, p. 47, https://doi.org/10.1007/s10853-017-1421-y.