A review of soft errors and the low α-solder bumping process in 3-D packaging technology.
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| Title: | A review of soft errors and the low α-solder bumping process in 3-D packaging technology. |
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| Authors: | Jung, D. H.1, Sharma, A.1, Jung, J. P.1, jpjung@uos.ac.kr |
| Source: | Journal of Materials Science; Jan2018, Vol. 53 Issue 1, p47-65, 19p |
| Database: | Applied Science & Technology Source |
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