APA (7th ed.) Citation

Straessle, R., Zimmermann, S., del Carro, L., Zurcher, J., Schlottig, G., Achen, A., . . . Brunschwiler, T. (2018). Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill. IEEE Transactions on Components, Packaging & Manufacturing Technology, 8(5), 840. https://doi.org/10.1109/TCPMT.2017.2775154

Chicago Style (17th ed.) Citation

Straessle, Rahel, Severin Zimmermann, Luca del Carro, Jonas Zurcher, Gerd Schlottig, Albert Achen, Guo Hong, Dimos Poulikakos, and Thomas Brunschwiler. "Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill." IEEE Transactions on Components, Packaging & Manufacturing Technology 8, no. 5 (2018): 840. https://doi.org/10.1109/TCPMT.2017.2775154.

MLA (9th ed.) Citation

Straessle, Rahel, et al. "Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill." IEEE Transactions on Components, Packaging & Manufacturing Technology, vol. 8, no. 5, 2018, p. 840, https://doi.org/10.1109/TCPMT.2017.2775154.