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Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill.

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Title: Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill.
Authors: Straessle, Rahel1, Zimmermann, Severin1, del Carro, Luca1, Zurcher, Jonas1, Schlottig, Gerd1, Achen, Albert2, Hong, Guo3, Poulikakos, Dimos3, Brunschwiler, Thomas1
Source: IEEE Transactions on Components, Packaging & Manufacturing Technology; May2018, Vol. 8 Issue 5, p840-850, 11p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 129614817
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill.
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  Data: <searchLink fieldCode="JN" term="%22IEEE+Transactions+on+Components%2C+Packaging+%26+Manufacturing+Technology%22">IEEE Transactions on Components, Packaging & Manufacturing Technology</searchLink>; May2018, Vol. 8 Issue 5, p840-850, 11p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=129614817
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1109/TCPMT.2017.2775154
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      – Code: eng
        Text: English
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        PageCount: 11
        StartPage: 840
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      – TitleFull: Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill.
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            NameFull: Straessle, Rahel
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            NameFull: Zimmermann, Severin
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            NameFull: Hong, Guo
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              M: 05
              Text: May2018
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              Y: 2018
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              Value: 5
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            – TitleFull: IEEE Transactions on Components, Packaging & Manufacturing Technology
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