APA (7th ed.) Citation

Lee, D., Lee, J., Kim, T., Lee, S., Park, Y., Joo, Y., & Kim, B. (2019). Effect of the Thermal Annealing on the Stretchability and Fatigue Failure of the Copper Film on the Polymer Substrate. Journal of Electronic Materials, 48(7), 4582. https://doi.org/10.1007/s11664-019-07237-z

Chicago Style (17th ed.) Citation

Lee, Dong-Jun, Jong-Sung Lee, Tae-Wook Kim, So-Yeon Lee, Young-Bae Park, Young-Chang Joo, and Byoung-Joon Kim. "Effect of the Thermal Annealing on the Stretchability and Fatigue Failure of the Copper Film on the Polymer Substrate." Journal of Electronic Materials 48, no. 7 (2019): 4582. https://doi.org/10.1007/s11664-019-07237-z.

MLA (9th ed.) Citation

Lee, Dong-Jun, et al. "Effect of the Thermal Annealing on the Stretchability and Fatigue Failure of the Copper Film on the Polymer Substrate." Journal of Electronic Materials, vol. 48, no. 7, 2019, p. 4582, https://doi.org/10.1007/s11664-019-07237-z.