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Effect of the Thermal Annealing on the Stretchability and Fatigue Failure of the Copper Film on the Polymer Substrate.

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Title: Effect of the Thermal Annealing on the Stretchability and Fatigue Failure of the Copper Film on the Polymer Substrate.
Authors: Lee, Dong-Jun1, Lee, Jong-Sung2, Kim, Tae-Wook1, Lee, So-Yeon2, Park, Young-Bae1, Joo, Young-Chang2, Kim, Byoung-Joon1, bjkim@anu.ac.kr
Source: Journal of Electronic Materials; Jul2019, Vol. 48 Issue 7, p4582-4588, 7p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 136769163
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Effect of the Thermal Annealing on the Stretchability and Fatigue Failure of the Copper Film on the Polymer Substrate.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; Jul2019, Vol. 48 Issue 7, p4582-4588, 7p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=136769163
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      – Type: doi
        Value: 10.1007/s11664-019-07237-z
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      – Code: eng
        Text: English
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        PageCount: 7
        StartPage: 4582
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      – TitleFull: Effect of the Thermal Annealing on the Stretchability and Fatigue Failure of the Copper Film on the Polymer Substrate.
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            NameFull: Lee, Dong-Jun
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            NameFull: Lee, Jong-Sung
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            NameFull: Kim, Tae-Wook
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            NameFull: Lee, So-Yeon
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            NameFull: Park, Young-Bae
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            NameFull: Joo, Young-Chang
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            NameFull: Kim, Byoung-Joon
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            – D: 01
              M: 07
              Text: Jul2019
              Type: published
              Y: 2019
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