Wang, S., Kirchlechner, C., Keer, L., Dehm, G., & Yao, Y. (2020). Interfacial fracture toughness of sintered hybrid silver interconnects. Journal of Materials Science, 55(7), 2891. https://doi.org/10.1007/s10853-019-04212-1
Chicago Style (17th ed.) CitationWang, Shaobin, Christoph Kirchlechner, Leon Keer, Gerhard Dehm, and Yao Yao. "Interfacial Fracture Toughness of Sintered Hybrid Silver Interconnects." Journal of Materials Science 55, no. 7 (2020): 2891. https://doi.org/10.1007/s10853-019-04212-1.
MLA (9th ed.) CitationWang, Shaobin, et al. "Interfacial Fracture Toughness of Sintered Hybrid Silver Interconnects." Journal of Materials Science, vol. 55, no. 7, 2020, p. 2891, https://doi.org/10.1007/s10853-019-04212-1.
Warning: These citations may not always be 100% accurate.