Aquabolt-XL HBM2-PIM, LPDDR5-PIM With In-Memory Processing, and AXDIMM With Acceleration Buffer.

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Title: Aquabolt-XL HBM2-PIM, LPDDR5-PIM With In-Memory Processing, and AXDIMM With Acceleration Buffer.
Authors: Kim, Jin Hyun1, kjh5555@samsung.com, Kang, Shin-Haeng1, s-h.kang@samsung.com, Lee, Sukhan1, sh1026.lee@samsung.com, Kim, Hyeonsu1, hyeonsu.kim@samsung.com, Ro, Yuhwan1, yuhwan.ro@samsung.com, Lee, Seungwon2, seungw.lee@samsung.com, Wang, David3, dt.wang@samsung.com, Choi, Jihyun1, jihyun0.choi@samsung.com, So, Jinin1, jinin.so@samsung.com, Cho, YeonGon2, yeongon.cho@samsung.com, Song, JoonHo2, joonho71.song@samsung.com, Cho, Jeonghyeon1, caleb1@samsung.com, Sohn, Kyomin2, kyomin.sohn@samsung.com, Kim, Nam Sung4, namsung1.kim@samsung.com
Source: IEEE Micro; May/Jun2022, Vol. 42 Issue 3, p20-30, 11p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 157007961
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Aquabolt-XL HBM2-PIM, LPDDR5-PIM With In-Memory Processing, and AXDIMM With Acceleration Buffer.
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  Data: <searchLink fieldCode="AU" term="%22Kim%2C+Jin+Hyun%22">Kim, Jin Hyun</searchLink><relatesTo>1</relatesTo>, <i>kjh5555@samsung.com</i><br /><searchLink fieldCode="AU" term="%22Kang%2C+Shin-Haeng%22">Kang, Shin-Haeng</searchLink><relatesTo>1</relatesTo>, <i>s-h.kang@samsung.com</i><br /><searchLink fieldCode="AU" term="%22Lee%2C+Sukhan%22">Lee, Sukhan</searchLink><relatesTo>1</relatesTo>, <i>sh1026.lee@samsung.com</i><br /><searchLink fieldCode="AU" term="%22Kim%2C+Hyeonsu%22">Kim, Hyeonsu</searchLink><relatesTo>1</relatesTo>, <i>hyeonsu.kim@samsung.com</i><br /><searchLink fieldCode="AU" term="%22Ro%2C+Yuhwan%22">Ro, Yuhwan</searchLink><relatesTo>1</relatesTo>, <i>yuhwan.ro@samsung.com</i><br /><searchLink fieldCode="AU" term="%22Lee%2C+Seungwon%22">Lee, Seungwon</searchLink><relatesTo>2</relatesTo>, <i>seungw.lee@samsung.com</i><br /><searchLink fieldCode="AU" term="%22Wang%2C+David%22">Wang, David</searchLink><relatesTo>3</relatesTo>, <i>dt.wang@samsung.com</i><br /><searchLink fieldCode="AU" term="%22Choi%2C+Jihyun%22">Choi, Jihyun</searchLink><relatesTo>1</relatesTo>, <i>jihyun0.choi@samsung.com</i><br /><searchLink fieldCode="AU" term="%22So%2C+Jinin%22">So, Jinin</searchLink><relatesTo>1</relatesTo>, <i>jinin.so@samsung.com</i><br /><searchLink fieldCode="AU" term="%22Cho%2C+YeonGon%22">Cho, YeonGon</searchLink><relatesTo>2</relatesTo>, <i>yeongon.cho@samsung.com</i><br /><searchLink fieldCode="AU" term="%22Song%2C+JoonHo%22">Song, JoonHo</searchLink><relatesTo>2</relatesTo>, <i>joonho71.song@samsung.com</i><br /><searchLink fieldCode="AU" term="%22Cho%2C+Jeonghyeon%22">Cho, Jeonghyeon</searchLink><relatesTo>1</relatesTo>, <i>caleb1@samsung.com</i><br /><searchLink fieldCode="AU" term="%22Sohn%2C+Kyomin%22">Sohn, Kyomin</searchLink><relatesTo>2</relatesTo>, <i>kyomin.sohn@samsung.com</i><br /><searchLink fieldCode="AU" term="%22Kim%2C+Nam+Sung%22">Kim, Nam Sung</searchLink><relatesTo>4</relatesTo>, <i>namsung1.kim@samsung.com</i>
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  Data: <searchLink fieldCode="JN" term="%22IEEE+Micro%22">IEEE Micro</searchLink>; May/Jun2022, Vol. 42 Issue 3, p20-30, 11p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=157007961
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        Value: 10.1109/MM.2022.3164651
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              Text: May/Jun2022
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