APA (7th ed.) Citation

Geng, T., Schick, B. W., Uhl, M., Kuehne, A. J. C., Kibler, L. A., Ceblin, M. U., & Jacob, T. (2022). Influence of Chloride and Nitrate Anions on Copper Electrodeposition onto Au(111) from Deep Eutectic Solvents. ChemElectroChem, 9(19), 1. https://doi.org/10.1002/celc.202101263

Chicago Style (17th ed.) Citation

Geng, Tanja, Benjamin W. Schick, Matthias Uhl, Alexander J. C. Kuehne, Ludwig A. Kibler, Maximilian U. Ceblin, and Timo Jacob. "Influence of Chloride and Nitrate Anions on Copper Electrodeposition onto Au(111) from Deep Eutectic Solvents." ChemElectroChem 9, no. 19 (2022): 1. https://doi.org/10.1002/celc.202101263.

MLA (9th ed.) Citation

Geng, Tanja, et al. "Influence of Chloride and Nitrate Anions on Copper Electrodeposition onto Au(111) from Deep Eutectic Solvents." ChemElectroChem, vol. 9, no. 19, 2022, p. 1, https://doi.org/10.1002/celc.202101263.