APA (7th ed.) Citation

Geng, T., Schick, B. W., Uhl, M., Kuehne, A. J. C., Kibler, L. A., Ceblin, M. U., & Jacob, T. (2022). Front Cover: Influence of Chloride and Nitrate Anions on Copper Electrodeposition onto Au(111) from Deep Eutectic Solvents (ChemElectroChem 19/2022). ChemElectroChem, 9(19), 1. https://doi.org/10.1002/celc.202200894

Chicago Style (17th ed.) Citation

Geng, Tanja, Benjamin W. Schick, Matthias Uhl, Alexander J. C. Kuehne, Ludwig A. Kibler, Maximilian U. Ceblin, and Timo Jacob. "Front Cover: Influence of Chloride and Nitrate Anions on Copper Electrodeposition onto Au(111) from Deep Eutectic Solvents (ChemElectroChem 19/2022)." ChemElectroChem 9, no. 19 (2022): 1. https://doi.org/10.1002/celc.202200894.

MLA (9th ed.) Citation

Geng, Tanja, et al. "Front Cover: Influence of Chloride and Nitrate Anions on Copper Electrodeposition onto Au(111) from Deep Eutectic Solvents (ChemElectroChem 19/2022)." ChemElectroChem, vol. 9, no. 19, 2022, p. 1, https://doi.org/10.1002/celc.202200894.