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Flexible Hybrid Electronics via Near‐Infrared Radiation‐Assisted Soldering of Surface Mount Devices on Screen Printed Circuits.

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Bibliographic Details
Title: Flexible Hybrid Electronics via Near‐Infrared Radiation‐Assisted Soldering of Surface Mount Devices on Screen Printed Circuits.
Authors: Kasi, Venkat1,2, Zareei, Amin1,2, Gopalakrishnan, Sarath2,3, Alcaraz, Alejandro M.1,2, Joshi, Shantanu4, Arfaei, Babak5, Rahimi, Rahim1,2, rrahimi@purdue.edu
Source: Advanced Electronic Materials; Apr2023, Vol. 9 Issue 4, p1-12, 12p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 163021133
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Flexible Hybrid Electronics via Near‐Infrared Radiation‐Assisted Soldering of Surface Mount Devices on Screen Printed Circuits.
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      – Type: doi
        Value: 10.1002/aelm.202201012
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      – Code: eng
        Text: English
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        PageCount: 12
        StartPage: 1
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      – TitleFull: Flexible Hybrid Electronics via Near‐Infrared Radiation‐Assisted Soldering of Surface Mount Devices on Screen Printed Circuits.
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      – PersonEntity:
          Name:
            NameFull: Kasi, Venkat
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            NameFull: Zareei, Amin
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            NameFull: Gopalakrishnan, Sarath
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            NameFull: Alcaraz, Alejandro M.
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            NameFull: Joshi, Shantanu
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            NameFull: Arfaei, Babak
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            NameFull: Rahimi, Rahim
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            – D: 01
              M: 04
              Text: Apr2023
              Type: published
              Y: 2023
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            – TitleFull: Advanced Electronic Materials
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