Fabrication of liquid metal/diamond hybrid thermal interface materials with high thermal conductivity and low flowability.
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| Title: | Fabrication of liquid metal/diamond hybrid thermal interface materials with high thermal conductivity and low flowability. |
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| Authors: | Wang, Wendong1,2, Wei, Song3, Du, Xinyu4, Ding, Zifeng4, Zhu, Qingsheng1,2, Qiao, Yanxin4, Wang, Xiaojing4, Guo, Jingdong1,2, jdguo@imr.ac.cn |
| Source: | Journal of Materials Science: Materials in Electronics; Jun2023, Vol. 34 Issue 18, p1-16, 16p |
| Database: | Applied Science & Technology Source |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 164433155 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Fabrication of liquid metal/diamond hybrid thermal interface materials with high thermal conductivity and low flowability. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Wang%2C+Wendong%22">Wang, Wendong</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Wei%2C+Song%22">Wei, Song</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Du%2C+Xinyu%22">Du, Xinyu</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AU" term="%22Ding%2C+Zifeng%22">Ding, Zifeng</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhu%2C+Qingsheng%22">Zhu, Qingsheng</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Qiao%2C+Yanxin%22">Qiao, Yanxin</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Xiaojing%22">Wang, Xiaojing</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AU" term="%22Guo%2C+Jingdong%22">Guo, Jingdong</searchLink><relatesTo>1,2</relatesTo>, <i>jdguo@imr.ac.cn</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jun2023, Vol. 34 Issue 18, p1-16, 16p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=164433155 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s10854-023-10827-7 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 16 StartPage: 1 Titles: – TitleFull: Fabrication of liquid metal/diamond hybrid thermal interface materials with high thermal conductivity and low flowability. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Wang, Wendong – PersonEntity: Name: NameFull: Wei, Song – PersonEntity: Name: NameFull: Du, Xinyu – PersonEntity: Name: NameFull: Ding, Zifeng – PersonEntity: Name: NameFull: Zhu, Qingsheng – PersonEntity: Name: NameFull: Qiao, Yanxin – PersonEntity: Name: NameFull: Wang, Xiaojing – PersonEntity: Name: NameFull: Guo, Jingdong IsPartOfRelationships: – BibEntity: Dates: – D: 21 M: 06 Text: Jun2023 Type: published Y: 2023 Identifiers: – Type: issn-print Value: 09574522 Numbering: – Type: volume Value: 34 – Type: issue Value: 18 Titles: – TitleFull: Journal of Materials Science: Materials in Electronics Type: main |
| ResultId | 1 |