APA (7th ed.) Citation

Sun, Q., Liu, Y., Zhang, J., Li, K., & Lu, J. (2023). Fabrication of high reliability Cu joints at low temperatures using synergistic effect of organic composition for power device packaging. Journal of Materials Science: Materials in Electronics, 34(21), 1. https://doi.org/10.1007/s10854-023-10951-4

Chicago Style (17th ed.) Citation

Sun, Quan, Yang Liu, Jing Zhang, Ke Li, and Jicun Lu. "Fabrication of High Reliability Cu Joints at Low Temperatures Using Synergistic Effect of Organic Composition for Power Device Packaging." Journal of Materials Science: Materials in Electronics 34, no. 21 (2023): 1. https://doi.org/10.1007/s10854-023-10951-4.

MLA (9th ed.) Citation

Sun, Quan, et al. "Fabrication of High Reliability Cu Joints at Low Temperatures Using Synergistic Effect of Organic Composition for Power Device Packaging." Journal of Materials Science: Materials in Electronics, vol. 34, no. 21, 2023, p. 1, https://doi.org/10.1007/s10854-023-10951-4.