Fabrication of high reliability Cu joints at low temperatures using synergistic effect of organic composition for power device packaging.
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| Title: | Fabrication of high reliability Cu joints at low temperatures using synergistic effect of organic composition for power device packaging. |
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| Authors: | Sun, Quan1, Liu, Yang1, yang_liu@hrbust.edu.cn, Zhang, Jing2, Li, Ke1, Lu, Jicun3 |
| Source: | Journal of Materials Science: Materials in Electronics; Jul2023, Vol. 34 Issue 21, p1-14, 14p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-023-10951-4 |
