View in EDS HTML Full Text PDF Full Text

Fabrication of high reliability Cu joints at low temperatures using synergistic effect of organic composition for power device packaging.

Saved in:
Bibliographic Details
Title: Fabrication of high reliability Cu joints at low temperatures using synergistic effect of organic composition for power device packaging.
Authors: Sun, Quan1, Liu, Yang1, yang_liu@hrbust.edu.cn, Zhang, Jing2, Li, Ke1, Lu, Jicun3
Source: Journal of Materials Science: Materials in Electronics; Jul2023, Vol. 34 Issue 21, p1-14, 14p
Database: Applied Science & Technology Source
Full text is not displayed to guests.
FullText Links:
  – Type: pdflink
Text:
  Availability: 1
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 167559186
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Fabrication of high reliability Cu joints at low temperatures using synergistic effect of organic composition for power device packaging.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Sun%2C+Quan%22">Sun, Quan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Yang%22">Liu, Yang</searchLink><relatesTo>1</relatesTo>, <i>yang_liu@hrbust.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Jing%22">Zhang, Jing</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Ke%22">Li, Ke</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lu%2C+Jicun%22">Lu, Jicun</searchLink><relatesTo>3</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jul2023, Vol. 34 Issue 21, p1-14, 14p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=167559186
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-023-10951-4
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 14
        StartPage: 1
    Titles:
      – TitleFull: Fabrication of high reliability Cu joints at low temperatures using synergistic effect of organic composition for power device packaging.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Sun, Quan
      – PersonEntity:
          Name:
            NameFull: Liu, Yang
      – PersonEntity:
          Name:
            NameFull: Zhang, Jing
      – PersonEntity:
          Name:
            NameFull: Li, Ke
      – PersonEntity:
          Name:
            NameFull: Lu, Jicun
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 21
              M: 07
              Text: Jul2023
              Type: published
              Y: 2023
          Identifiers:
            – Type: issn-print
              Value: 09574522
          Numbering:
            – Type: volume
              Value: 34
            – Type: issue
              Value: 21
          Titles:
            – TitleFull: Journal of Materials Science: Materials in Electronics
              Type: main
ResultId 1