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Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure.

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Title: Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure.
Authors: SIDDHU, LOKESH1, siddhulokesh@gmail.com, BAGCHI, ARITRA1, aritra.bagchi@cse.iitd.ac.in, KEDIA, RAJESH2, rkedia@cse.iith.ac.in, AHMAD, ISAAR2, isaar.ahmad@gmail.com, PANDEY, SHAILJA1, csz168117@iitd.ac.in, PANDA, PREETI RANJAN1, panda@cse.iitd.ac.in
Source: ACM Transactions on Embedded Computing Systems; Nov2023, Vol. 22 Issue 6, p1-27, 27p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 173650331
AccessLevel: 2
PubType: Academic Journal
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  Data: <searchLink fieldCode="JN" term="%22ACM+Transactions+on+Embedded+Computing+Systems%22">ACM Transactions on Embedded Computing Systems</searchLink>; Nov2023, Vol. 22 Issue 6, p1-27, 27p
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        Value: 10.1145/3624581
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              Text: Nov2023
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