Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure.
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| Title: | Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure. |
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| Authors: | SIDDHU, LOKESH1, siddhulokesh@gmail.com, BAGCHI, ARITRA1, aritra.bagchi@cse.iitd.ac.in, KEDIA, RAJESH2, rkedia@cse.iith.ac.in, AHMAD, ISAAR2, isaar.ahmad@gmail.com, PANDEY, SHAILJA1, csz168117@iitd.ac.in, PANDA, PREETI RANJAN1, panda@cse.iitd.ac.in |
| Source: | ACM Transactions on Embedded Computing Systems; Nov2023, Vol. 22 Issue 6, p1-27, 27p |
| Database: | Applied Science & Technology Source |
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