Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material. - Lee, Jing Rou; Chong, Mun Xi; Abdul Aziz, Mohd Sharizal; Khor, Chu Yee; Mohd Salleh, Mohd Arif Anuar; Mohd Arif Zainol, Mohd Remy Rozainy; Ani, F. Che (Journal of Electronic Materials, 2024)