Plasma‐Enhanced Atomic Layer Deposition of Amorphous Tantalum Thin Films for Copper Interconnects Using an Organometallic Precursor. - Tian, Xu; Ding, Yuancan; Chai, Gaoda; Tang, Yupu; Lei, Renbo; Jia, Guodong; Zhang, Yuanju; Li, Jinxiong; Zhou, Yi; Wang, Xinwei (Advanced Materials Technologies, 2024)