Ding, Y., Qi, C., Chen, Q., Ge, H., Ren, B., Liu, R., . . . Jia, Y. (2024). Computational modeling and simulation of temperature field evolution during the chemical foaming of epoxy foams. Polymer Engineering & Science, 64(3), 1312. https://doi.org/10.1002/pen.26617
Chicago Style (17th ed.) CitationDing, Yanyu, Chaoqun Qi, Qifeng Chen, Heyi Ge, Baosheng Ren, Rui Liu, Guilong Wang, and Yuxi Jia. "Computational Modeling and Simulation of Temperature Field Evolution During the Chemical Foaming of Epoxy Foams." Polymer Engineering & Science 64, no. 3 (2024): 1312. https://doi.org/10.1002/pen.26617.
MLA (9th ed.) CitationDing, Yanyu, et al. "Computational Modeling and Simulation of Temperature Field Evolution During the Chemical Foaming of Epoxy Foams." Polymer Engineering & Science, vol. 64, no. 3, 2024, p. 1312, https://doi.org/10.1002/pen.26617.