Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles. - Cui, Ze; Jia, Qiang; Wang, Yishu; Li, Dan; Wang, Chien-Ping; Zhang, Hongqiang; Lu, Ziyi; Ma, Limin; Zou, Guisheng; Guo, Fu (Journal of Materials Science: Materials in Electronics, 2024)