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Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging.

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Title: Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging.
Authors: Cui, Ze1, Jia, Qiang1, Zhang, Hongqiang2, Wang, Yishu1, Ma, Limin1, malimin@bjut.edu.cn, Zou, Guisheng3, Guo, Fu1,4, guofu@bjut.edu.cn
Source: Journal of Electronic Materials; Jun2024, Vol. 53 Issue 6, p2703-2726, 24p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 178046849
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging.
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RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s11664-024-10970-9
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      – Code: eng
        Text: English
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        PageCount: 24
        StartPage: 2703
    Titles:
      – TitleFull: Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging.
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          Name:
            NameFull: Cui, Ze
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            NameFull: Jia, Qiang
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            NameFull: Zhang, Hongqiang
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            NameFull: Wang, Yishu
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            NameFull: Ma, Limin
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            NameFull: Zou, Guisheng
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            NameFull: Guo, Fu
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            – D: 01
              M: 06
              Text: Jun2024
              Type: published
              Y: 2024
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              Value: 53
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            – TitleFull: Journal of Electronic Materials
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