Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging.
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| Title: | Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging. |
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| Authors: | Cui, Ze1, Jia, Qiang1, Zhang, Hongqiang2, Wang, Yishu1, Ma, Limin1, malimin@bjut.edu.cn, Zou, Guisheng3, Guo, Fu1,4, guofu@bjut.edu.cn |
| Source: | Journal of Electronic Materials; Jun2024, Vol. 53 Issue 6, p2703-2726, 24p |
| Database: | Applied Science & Technology Source |
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