APA (7th ed.) Citation

Liu, S., Yang, L., Xin, J., Lv, X., Chen, Y., & Liu, Y. (2024). Sintering of Cu particles baked by formic acid vapor for Cu–Cu low temperature bonding. Journal of Materials Science: Materials in Electronics, 35(22), 1. https://doi.org/10.1007/s10854-024-13220-0

Chicago Style (17th ed.) Citation

Liu, Sushi, Le Yang, Jianbo Xin, Xiaochun Lv, Yi Chen, and Yang Liu. "Sintering of Cu Particles Baked by Formic Acid Vapor for Cu–Cu Low Temperature Bonding." Journal of Materials Science: Materials in Electronics 35, no. 22 (2024): 1. https://doi.org/10.1007/s10854-024-13220-0.

MLA (9th ed.) Citation

Liu, Sushi, et al. "Sintering of Cu Particles Baked by Formic Acid Vapor for Cu–Cu Low Temperature Bonding." Journal of Materials Science: Materials in Electronics, vol. 35, no. 22, 2024, p. 1, https://doi.org/10.1007/s10854-024-13220-0.