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Sintering of Cu particles baked by formic acid vapor for Cu–Cu low temperature bonding.

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Title: Sintering of Cu particles baked by formic acid vapor for Cu–Cu low temperature bonding.
Authors: Liu, Sushi1, Yang, Le1, Xin, Jianbo1, Lv, Xiaochun1,2, Chen, Yi1, Liu, Yang1, yang_liu@hrbust.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Aug2024, Vol. 35 Issue 22, p1-11, 11p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 178776740
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Sintering of Cu particles baked by formic acid vapor for Cu–Cu low temperature bonding.
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  Data: <searchLink fieldCode="AU" term="%22Liu%2C+Sushi%22">Liu, Sushi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yang%2C+Le%22">Yang, Le</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Xin%2C+Jianbo%22">Xin, Jianbo</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lv%2C+Xiaochun%22">Lv, Xiaochun</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Yi%22">Chen, Yi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Yang%22">Liu, Yang</searchLink><relatesTo>1</relatesTo>, <i>yang_liu@hrbust.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Aug2024, Vol. 35 Issue 22, p1-11, 11p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=178776740
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-024-13220-0
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      – Code: eng
        Text: English
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        PageCount: 11
        StartPage: 1
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      – TitleFull: Sintering of Cu particles baked by formic acid vapor for Cu–Cu low temperature bonding.
        Type: main
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          Name:
            NameFull: Liu, Sushi
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            NameFull: Yang, Le
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            NameFull: Xin, Jianbo
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            NameFull: Lv, Xiaochun
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            NameFull: Chen, Yi
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            NameFull: Liu, Yang
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          Dates:
            – D: 01
              M: 08
              Text: Aug2024
              Type: published
              Y: 2024
          Identifiers:
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              Value: 09574522
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              Value: 35
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              Value: 22
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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