Sintering of Cu particles baked by formic acid vapor for Cu–Cu low temperature bonding.
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| Title: | Sintering of Cu particles baked by formic acid vapor for Cu–Cu low temperature bonding. |
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| Authors: | Liu, Sushi1, Yang, Le1, Xin, Jianbo1, Lv, Xiaochun1,2, Chen, Yi1, Liu, Yang1, yang_liu@hrbust.edu.cn |
| Source: | Journal of Materials Science: Materials in Electronics; Aug2024, Vol. 35 Issue 22, p1-11, 11p |
| Database: | Applied Science & Technology Source |
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