APA (7th ed.) Citation

Li, M., Hu, Z., Yan, B., Wang, J., Zhang, H., Ye, F., . . . Yang, Z. (2024). A flexible resistive strain gauge with reduced temperature effect via thermal expansion anisotropic composite substrate. Microsystems & Nanoengineering, 10(1), 1. https://doi.org/10.1038/s41378-024-00762-w

Chicago Style (17th ed.) Citation

Li, Mengqiu, et al. "A Flexible Resistive Strain Gauge with Reduced Temperature Effect via Thermal Expansion Anisotropic Composite Substrate." Microsystems & Nanoengineering 10, no. 1 (2024): 1. https://doi.org/10.1038/s41378-024-00762-w.

MLA (9th ed.) Citation

Li, Mengqiu, et al. "A Flexible Resistive Strain Gauge with Reduced Temperature Effect via Thermal Expansion Anisotropic Composite Substrate." Microsystems & Nanoengineering, vol. 10, no. 1, 2024, p. 1, https://doi.org/10.1038/s41378-024-00762-w.