Weng, G., Sun, Q., Yang, B., Chen, J., & Lu, Y. (2024). Improving the Electrical and Mechanical Behavior of Printed Ag Microwires on Flexible Substrates by Applying High-Density Pulsed Electric Current. Journal of Electronic Materials, 53(12), 7858. https://doi.org/10.1007/s11664-024-11482-2
Chicago Style (17th ed.) CitationWeng, Guoqiang, Quan Sun, Boxin Yang, Jianneng Chen, and Yebo Lu. "Improving the Electrical and Mechanical Behavior of Printed Ag Microwires on Flexible Substrates by Applying High-Density Pulsed Electric Current." Journal of Electronic Materials 53, no. 12 (2024): 7858. https://doi.org/10.1007/s11664-024-11482-2.
MLA (9th ed.) CitationWeng, Guoqiang, et al. "Improving the Electrical and Mechanical Behavior of Printed Ag Microwires on Flexible Substrates by Applying High-Density Pulsed Electric Current." Journal of Electronic Materials, vol. 53, no. 12, 2024, p. 7858, https://doi.org/10.1007/s11664-024-11482-2.