Effect of reflow profiles on the microstructure and shear properties of non-eutectic Sn-35Bi-1Ag solders.

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Title: Effect of reflow profiles on the microstructure and shear properties of non-eutectic Sn-35Bi-1Ag solders.
Authors: Meng, Zhichao1,2, Cai, Shanshan3, Wang, Qin4, Wang, Xiaojing5, Li, Zhenyuan1,2, Wan, Yongkang1,2, Wang, Jiajun4, wjj1209@outlook.com, Long, Dengcheng4
Source: Journal of Materials Science: Materials in Electronics; Nov2024, Vol. 35 Issue 33, p1-11, 11p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 181104793
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PubTypeId: academicJournal
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  Data: Effect of reflow profiles on the microstructure and shear properties of non-eutectic Sn-35Bi-1Ag solders.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Nov2024, Vol. 35 Issue 33, p1-11, 11p
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-024-13814-8
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      – Code: eng
        Text: English
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        PageCount: 11
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      – TitleFull: Effect of reflow profiles on the microstructure and shear properties of non-eutectic Sn-35Bi-1Ag solders.
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            NameFull: Meng, Zhichao
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            NameFull: Cai, Shanshan
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            NameFull: Wang, Qin
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            NameFull: Wang, Xiaojing
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            NameFull: Li, Zhenyuan
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            NameFull: Wan, Yongkang
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            NameFull: Wang, Jiajun
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            NameFull: Long, Dengcheng
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            – D: 21
              M: 11
              Text: Nov2024
              Type: published
              Y: 2024
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              Value: 33
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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