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Mechanical bonding and metallurgical bonding synergistically optimize the shear properties of the Ni/Bi2Te3 joint interface.

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Title: Mechanical bonding and metallurgical bonding synergistically optimize the shear properties of the Ni/Bi2Te3 joint interface.
Authors: Fang, Cheng1, Chen, Gang1, Li, Zifeng1, Wang, Xu1, Duan, Bo1, duanboabc@whut.edu.cn, Feng, Xiaobin1, Li, Guodong1,2, Zhai, Pengcheng1,2
Source: Journal of Materials Science: Materials in Electronics; Jan2025, Vol. 36 Issue 3, p1-10, 10p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 182460099
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Mechanical bonding and metallurgical bonding synergistically optimize the shear properties of the Ni/Bi2Te3 joint interface.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jan2025, Vol. 36 Issue 3, p1-10, 10p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=182460099
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-025-14263-7
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      – Code: eng
        Text: English
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        PageCount: 10
        StartPage: 1
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      – TitleFull: Mechanical bonding and metallurgical bonding synergistically optimize the shear properties of the Ni/Bi2Te3 joint interface.
        Type: main
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            NameFull: Fang, Cheng
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            NameFull: Chen, Gang
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            NameFull: Li, Zifeng
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            NameFull: Wang, Xu
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            NameFull: Duan, Bo
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            NameFull: Feng, Xiaobin
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            NameFull: Li, Guodong
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            NameFull: Zhai, Pengcheng
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            – D: 21
              M: 01
              Text: Jan2025
              Type: published
              Y: 2025
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              Value: 36
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            – TitleFull: Journal of Materials Science: Materials in Electronics
              Type: main
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