APA (7th ed.) Citation

Gong, Z., Dong, S., Chen, Z., Qu, Y., Chen, R., Li, G., & Zhang, W. (2025). Enhanced tensile creep property at 700 °C and microstructure evolution of Ti60 alloy rolled sheet induced by solution-aging treatment. Journal of Materials Science, 60(13), 5925. https://doi.org/10.1007/s10853-025-10767-z

Chicago Style (17th ed.) Citation

Gong, Zhen, Shulin Dong, Zhiyong Chen, Yingdong Qu, Ruirun Chen, Guanglong Li, and Wei Zhang. "Enhanced Tensile Creep Property at 700 °C and Microstructure Evolution of Ti60 Alloy Rolled Sheet Induced by Solution-aging Treatment." Journal of Materials Science 60, no. 13 (2025): 5925. https://doi.org/10.1007/s10853-025-10767-z.

MLA (9th ed.) Citation

Gong, Zhen, et al. "Enhanced Tensile Creep Property at 700 °C and Microstructure Evolution of Ti60 Alloy Rolled Sheet Induced by Solution-aging Treatment." Journal of Materials Science, vol. 60, no. 13, 2025, p. 5925, https://doi.org/10.1007/s10853-025-10767-z.