Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Liu, Zhou, Kong, Y. W. Li, Xing, Pang, Wu, Ma, and P. Li. - Liu, X.; Zhou, T. H.; Kong, L. W.; Li, Y. W.; Xing, Z. B.; Pang, L.; Wu, W. B.; Ma, K. Y.; Li, P. (JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025)