APA (7th ed.) Citation

Kim, Y., & Lee, J. (2025). Effects of Ag shell morphology on sinter-bonding by thermo-compression of micron Cu@Ag/submicron Ag composite paste. Journal of Materials Science: Materials in Electronics, 36(14), 1. https://doi.org/10.1007/s10854-025-14848-2

Chicago Style (17th ed.) Citation

Kim, Yeongjung, and Jong-Hyun Lee. "Effects of Ag Shell Morphology on Sinter-bonding by Thermo-compression of Micron Cu@Ag/submicron Ag Composite Paste." Journal of Materials Science: Materials in Electronics 36, no. 14 (2025): 1. https://doi.org/10.1007/s10854-025-14848-2.

MLA (9th ed.) Citation

Kim, Yeongjung, and Jong-Hyun Lee. "Effects of Ag Shell Morphology on Sinter-bonding by Thermo-compression of Micron Cu@Ag/submicron Ag Composite Paste." Journal of Materials Science: Materials in Electronics, vol. 36, no. 14, 2025, p. 1, https://doi.org/10.1007/s10854-025-14848-2.