Effects of Ag shell morphology on sinter-bonding by thermo-compression of micron Cu@Ag/submicron Ag composite paste.
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| Title: | Effects of Ag shell morphology on sinter-bonding by thermo-compression of micron Cu@Ag/submicron Ag composite paste. |
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| Authors: | Kim, Yeongjung1, Lee, Jong-Hyun1,2, pljh@snut.ac.kr |
| Source: | Journal of Materials Science: Materials in Electronics; May2025, Vol. 36 Issue 14, p1-16, 16p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-025-14848-2 |
