APA (7th ed.) Citation

Cui, Z., Jia, Q., Gao, X., Lu, Z., Wang, Y., Li, D., . . . Guo, F. (2025). Influence of aging atmosphere on the thermal stability of low-temperature sintered Cu joints based on Cu nanoparticles. Journal of Materials Science: Materials in Electronics, 36(16), 1. https://doi.org/10.1007/s10854-025-15039-9

Chicago Style (17th ed.) Citation

Cui, Ze, et al. "Influence of Aging Atmosphere on the Thermal Stability of Low-temperature Sintered Cu Joints Based on Cu Nanoparticles." Journal of Materials Science: Materials in Electronics 36, no. 16 (2025): 1. https://doi.org/10.1007/s10854-025-15039-9.

MLA (9th ed.) Citation

Cui, Ze, et al. "Influence of Aging Atmosphere on the Thermal Stability of Low-temperature Sintered Cu Joints Based on Cu Nanoparticles." Journal of Materials Science: Materials in Electronics, vol. 36, no. 16, 2025, p. 1, https://doi.org/10.1007/s10854-025-15039-9.