Influence of aging atmosphere on the thermal stability of low-temperature sintered Cu joints based on Cu nanoparticles.
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| Title: | Influence of aging atmosphere on the thermal stability of low-temperature sintered Cu joints based on Cu nanoparticles. |
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| Authors: | Cui, Ze1, Jia, Qiang1, Gao, Xu1, Lu, Ziyi1, Wang, Yishu1, Li, Dan1, Zhang, Hongqiang2, Ma, Limin1, malimin@bjut.edu.cn, Zou, Guisheng3, Guo, Fu1,4, guofu@bjut.edu.cn |
| Source: | Journal of Materials Science: Materials in Electronics; Jun2025, Vol. 36 Issue 16, p1-18, 18p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-025-15039-9 |
