Influence of aging atmosphere on the thermal stability of low-temperature sintered Cu joints based on Cu nanoparticles.

Saved in:
Bibliographic Details
Title: Influence of aging atmosphere on the thermal stability of low-temperature sintered Cu joints based on Cu nanoparticles.
Authors: Cui, Ze1, Jia, Qiang1, Gao, Xu1, Lu, Ziyi1, Wang, Yishu1, Li, Dan1, Zhang, Hongqiang2, Ma, Limin1, malimin@bjut.edu.cn, Zou, Guisheng3, Guo, Fu1,4, guofu@bjut.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Jun2025, Vol. 36 Issue 16, p1-18, 18p
Database: Applied Science & Technology Source
Full text is not displayed to guests.
FullText Links:
  – Type: pdflink
Text:
  Availability: 1
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 185850214
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Influence of aging atmosphere on the thermal stability of low-temperature sintered Cu joints based on Cu nanoparticles.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Cui%2C+Ze%22">Cui, Ze</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Jia%2C+Qiang%22">Jia, Qiang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Gao%2C+Xu%22">Gao, Xu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lu%2C+Ziyi%22">Lu, Ziyi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Yishu%22">Wang, Yishu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Dan%22">Li, Dan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Hongqiang%22">Zhang, Hongqiang</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Ma%2C+Limin%22">Ma, Limin</searchLink><relatesTo>1</relatesTo>, <i>malimin@bjut.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Zou%2C+Guisheng%22">Zou, Guisheng</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Guo%2C+Fu%22">Guo, Fu</searchLink><relatesTo>1,4</relatesTo>, <i>guofu@bjut.edu.cn</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jun2025, Vol. 36 Issue 16, p1-18, 18p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=185850214
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-025-15039-9
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 18
        StartPage: 1
    Titles:
      – TitleFull: Influence of aging atmosphere on the thermal stability of low-temperature sintered Cu joints based on Cu nanoparticles.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Cui, Ze
      – PersonEntity:
          Name:
            NameFull: Jia, Qiang
      – PersonEntity:
          Name:
            NameFull: Gao, Xu
      – PersonEntity:
          Name:
            NameFull: Lu, Ziyi
      – PersonEntity:
          Name:
            NameFull: Wang, Yishu
      – PersonEntity:
          Name:
            NameFull: Li, Dan
      – PersonEntity:
          Name:
            NameFull: Zhang, Hongqiang
      – PersonEntity:
          Name:
            NameFull: Ma, Limin
      – PersonEntity:
          Name:
            NameFull: Zou, Guisheng
      – PersonEntity:
          Name:
            NameFull: Guo, Fu
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 06
              Text: Jun2025
              Type: published
              Y: 2025
          Identifiers:
            – Type: issn-print
              Value: 09574522
          Numbering:
            – Type: volume
              Value: 36
            – Type: issue
              Value: 16
          Titles:
            – TitleFull: Journal of Materials Science: Materials in Electronics
              Type: main
ResultId 1