APA (7th ed.) Citation

Yang, W., Zhang, Y., Cheng, X., Luo, X., Liu, G., Qiu, J., & Lyu, K. (2026). Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires. Applied Sciences (2076-3417), 16(2), 949. https://doi.org/10.3390/app16020949

Chicago Style (17th ed.) Citation

Yang, Wenxiang, Yong Zhang, Xianzhe Cheng, Xinyu Luo, Guanjun Liu, Jing Qiu, and Kehong Lyu. "Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires." Applied Sciences (2076-3417) 16, no. 2 (2026): 949. https://doi.org/10.3390/app16020949.

MLA (9th ed.) Citation

Yang, Wenxiang, et al. "Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires." Applied Sciences (2076-3417), vol. 16, no. 2, 2026, p. 949, https://doi.org/10.3390/app16020949.