Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires.
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| Title: | Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires. |
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| Authors: | Yang, Wenxiang1,2, Zhang, Yong1,2, Cheng, Xianzhe3, Luo, Xinyu1,2, Liu, Guanjun1,2, Qiu, Jing1,2,3, Lyu, Kehong1,2, fhrlkh@163.com |
| Source: | Applied Sciences (2076-3417); Jan2026, Vol. 16 Issue 2, p949, 29p |
| Database: | Applied Science & Technology Source |
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| FullText | Links: – Type: pdflink Text: Availability: 1 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 191218343 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Yang%2C+Wenxiang%22">Yang, Wenxiang</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Yong%22">Zhang, Yong</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Cheng%2C+Xianzhe%22">Cheng, Xianzhe</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Luo%2C+Xinyu%22">Luo, Xinyu</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Guanjun%22">Liu, Guanjun</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Qiu%2C+Jing%22">Qiu, Jing</searchLink><relatesTo>1,2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Lyu%2C+Kehong%22">Lyu, Kehong</searchLink><relatesTo>1,2</relatesTo>, <i>fhrlkh@163.com</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Applied+Sciences+%282076-3417%29%22">Applied Sciences (2076-3417)</searchLink>; Jan2026, Vol. 16 Issue 2, p949, 29p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=191218343 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.3390/app16020949 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 29 StartPage: 949 Titles: – TitleFull: Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Yang, Wenxiang – PersonEntity: Name: NameFull: Zhang, Yong – PersonEntity: Name: NameFull: Cheng, Xianzhe – PersonEntity: Name: NameFull: Luo, Xinyu – PersonEntity: Name: NameFull: Liu, Guanjun – PersonEntity: Name: NameFull: Qiu, Jing – PersonEntity: Name: NameFull: Lyu, Kehong IsPartOfRelationships: – BibEntity: Dates: – D: 15 M: 01 Text: Jan2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 20763417 Numbering: – Type: volume Value: 16 – Type: issue Value: 2 Titles: – TitleFull: Applied Sciences (2076-3417) Type: main |
| ResultId | 1 |