Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires.

Saved in:
Bibliographic Details
Title: Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires.
Authors: Yang, Wenxiang1,2, Zhang, Yong1,2, Cheng, Xianzhe3, Luo, Xinyu1,2, Liu, Guanjun1,2, Qiu, Jing1,2,3, Lyu, Kehong1,2, fhrlkh@163.com
Source: Applied Sciences (2076-3417); Jan2026, Vol. 16 Issue 2, p949, 29p
Database: Applied Science & Technology Source
Full text is not displayed to guests.
FullText Links:
  – Type: pdflink
Text:
  Availability: 1
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 191218343
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Yang%2C+Wenxiang%22">Yang, Wenxiang</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Yong%22">Zhang, Yong</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Cheng%2C+Xianzhe%22">Cheng, Xianzhe</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Luo%2C+Xinyu%22">Luo, Xinyu</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Guanjun%22">Liu, Guanjun</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Qiu%2C+Jing%22">Qiu, Jing</searchLink><relatesTo>1,2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Lyu%2C+Kehong%22">Lyu, Kehong</searchLink><relatesTo>1,2</relatesTo>, <i>fhrlkh@163.com</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Applied+Sciences+%282076-3417%29%22">Applied Sciences (2076-3417)</searchLink>; Jan2026, Vol. 16 Issue 2, p949, 29p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=191218343
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.3390/app16020949
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 29
        StartPage: 949
    Titles:
      – TitleFull: Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Yang, Wenxiang
      – PersonEntity:
          Name:
            NameFull: Zhang, Yong
      – PersonEntity:
          Name:
            NameFull: Cheng, Xianzhe
      – PersonEntity:
          Name:
            NameFull: Luo, Xinyu
      – PersonEntity:
          Name:
            NameFull: Liu, Guanjun
      – PersonEntity:
          Name:
            NameFull: Qiu, Jing
      – PersonEntity:
          Name:
            NameFull: Lyu, Kehong
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 15
              M: 01
              Text: Jan2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 20763417
          Numbering:
            – Type: volume
              Value: 16
            – Type: issue
              Value: 2
          Titles:
            – TitleFull: Applied Sciences (2076-3417)
              Type: main
ResultId 1