Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires.
Saved in:
| Title: | Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires. |
|---|---|
| Authors: | Yang, Wenxiang1,2, Zhang, Yong1,2, Cheng, Xianzhe3, Luo, Xinyu1,2, Liu, Guanjun1,2, Qiu, Jing1,2,3, Lyu, Kehong1,2, fhrlkh@163.com |
| Source: | Applied Sciences (2076-3417); Jan2026, Vol. 16 Issue 2, p949, 29p |
| Database: | Applied Science & Technology Source |
|
Full text is not displayed to guests.
Login for full access.
|
|
Be the first to leave a comment!
