APA (7th ed.) Citation

Friedrich, M., Schlosser, T., & Kowerko, D. (2026). Simulation of semiconductor wafer dicing induced faults on chips and their application as augmentation method for a deep learning based visual inspection system. Journal of Intelligent Manufacturing, 37(2), 573. https://doi.org/10.1007/s10845-024-02559-0

Chicago Style (17th ed.) Citation

Friedrich, Michael, Tobias Schlosser, and Danny Kowerko. "Simulation of Semiconductor Wafer Dicing Induced Faults on Chips and Their Application as Augmentation Method for a Deep Learning Based Visual Inspection System." Journal of Intelligent Manufacturing 37, no. 2 (2026): 573. https://doi.org/10.1007/s10845-024-02559-0.

MLA (9th ed.) Citation

Friedrich, Michael, et al. "Simulation of Semiconductor Wafer Dicing Induced Faults on Chips and Their Application as Augmentation Method for a Deep Learning Based Visual Inspection System." Journal of Intelligent Manufacturing, vol. 37, no. 2, 2026, p. 573, https://doi.org/10.1007/s10845-024-02559-0.